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The wafer fabrication engineer will work as part of a technical team focusing on
wafering technology for semiconductor materials, such as wire sawing, grinding, lapping,
and polishing.
Qualifications:
- BS in engineering or equivalent experience required, MS or PhD preferred.
- Strong technical competence in scientific fundamentals.
- Experience in wire sawing, grinding, lapping, polishing and/or CMP of
semiconductor materials is a plus.
- Familiar with statistical process control (SPC) and experimental design
and analysis (DOE).
- A fully engaged work ethic and good communication and reporting skills
within a technical team are a must.
Compensation - A competitive salary with stock options and benefits will be
offered commensurate to the experience and qualifications of the candidate. EOE.
How to Apply: Interested candidates should submit a cover letter & resume
via email to aacg@att.net
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